Specification of XCZU9EG-3FFVC900E | |
---|---|
Status | Active |
Series | Zynq? UltraScale+? MPSoC EG |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 600MHz, 1.5GHz |
Primary Attributes | ZynqUltraScale+ FPGA, 599K+ Logic Cells |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 900-BBGA, FCBGA |
Supplier Device Package | 900-FCBGA (31×31) |
Applications
The XCZU9EG-3FFVC900E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It excels in applications requiring high-speed data processing and large-scale parallel computing tasks. This FPGA can operate within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High computational throughput up to 768 Gbps
2. Advanced multi-core architecture supporting up to 16 concurrent operations
3. Energy consumption as low as 15W at full load
4. Meets industry-standard certifications including ISO 9001 and CE marking
Frequently Asked Questions
Q1: What is the maximum operating temperature for the XCZU9EG-3FFVC900E?
A1: The maximum operating temperature for the XCZU9EG-3FFVC900E is +85¡ãC.
Q2: Can the XCZU9EG-3FFVC900E be used in conjunction with other FPGAs?
A2: Yes, the XCZU9EG-3FFVC900E is compatible with a variety of other FPGAs through standard interfaces like AXI and PCIe.
Q3: In which specific scenarios would you recommend using the XCZU9EG-3FFVC900E?
A3: The XCZU9EG-3FFVC900E is recommended for scenarios involving real-time signal processing, machine learning inference, and high-frequency trading due to its high performance and energy efficiency.
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