Specification of XCZU11EG-2FFVC1156E | |
---|---|
Status | Active |
Series | Zynq? UltraScale+? MPSoC EG |
Package | Tray |
Supplier | AMD |
Architecture | MCU, FPGA |
Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 |
Flash Size | – |
RAM Size | 256KB |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 533MHz, 600MHz, 1.3GHz |
Primary Attributes | ZynqUltraScale+ FPGA, 653K+ Logic Cells |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1156-BBGA, FCBGA |
Supplier Device Package | 1156-FCBGA (35×35) |
Applications
The XCZU11EG-2FFVC1156E is ideal for high-performance computing environments due to its advanced processing capabilities. It excels in applications such as artificial intelligence training, big data analytics, and cloud computing services. This FPGA offers a wide range of operating temperatures from -40°C to +85°C, making it suitable for various industrial settings.
Key Advantages
1. High-speed processing at up to 760 MHz
2. Advanced multi-core architecture supporting parallel processing
3. Energy-efficient design with power consumption as low as 15W at maximum load
4. Meets stringent industry certifications including ISO 9001 and CE marking
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCZU11EG-2FFVC1156E?
A1: The XCZU11EG-2FFVC1156E supports an operating temperature range from -40°C to +85°C.
Q2: Can the XCZU11EG-2FFVC1156E be used in conjunction with other FPGAs?
A2: Yes, the XCZU11EG-2FFVC1156E can be integrated with other FPGAs through standard interfaces like AXI and PCIe, facilitating complex system architectures.
Q3: In which specific scenarios would you recommend using the XCZU11EG-2FFVC1156E?
A3: The XCZU11EG-2FFVC1156E is recommended for scenarios requiring high computational performance, such as deep learning model training, real-time signal processing, and high-frequency trading systems.
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