XCVU9P-L2FLGC2104E

Applications

The XCVU9P-L2FLGC2104E is ideal for high-performance computing environments such as data centers, cloud computing services, and artificial intelligence training. It excels in handling large-scale data processing tasks efficiently. In industrial settings, it supports real-time control systems in manufacturing plants, ensuring precise operations under varying conditions.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High Performance: The XCVU9P-L2FLGC2104E offers up to 768 Gbps of memory bandwidth, enabling faster data transfer rates compared to its predecessors.

2. Scalable Architecture: Its modular design allows for easy expansion and integration into complex system architectures without significant redesign efforts.

3. Energy Efficiency: With a power consumption of less than 100W at maximum load, it provides excellent energy efficiency, making it suitable for power-constrained environments.

4. Industry Certifications: The chip has been certified to meet stringent safety and reliability standards, including ISO 9001 and IEC 61000-6-2.

Frequently Asked Questions

Q1: What is the maximum clock frequency supported by the XCVU9P-L2FLGC2104E?

A1: The XCVU9P-L2FLGC2104E can operate at frequencies up to 1.5 GHz, providing high-speed processing capabilities.

Q2: Is the XCVU9P-L2FLGC2104E compatible with existing hardware?

A2: Yes, the XCVU9P-L2FLGC2104E is backward-compatible with most existing hardware interfaces, allowing for smooth integration into current systems.

Q3: Can the XCVU9P-L2FLGC2104E be used in edge computing devices?

A3: Absolutely, its compact size and low power consumption make it well-suited for deployment in edge computing devices that require high performance but limited space and power supply.

Other people’s search terms

– High-performance computing solutions

– AI acceleration chips

– Data center optimization technology

– Industrial automation controllers

– Low-power embedded systems