Specification of XCVU7P-2FLVC2104I | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 98520 |
Number of Logic Elements/Cells | 1724100 |
Total RAM Bits | 260812800 |
Number of I/O | 416 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU7P-2FLVC2104I is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU7P-2FLVC2104I operate effectively at extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40°C to +85°C, making it suitable for both indoor and outdoor applications.
Q2: Is the XCVU7P-2FLVC2104I compatible with existing hardware?
A2: The XCVU7P-2FLVC2104I is backward-compatible with previous models but offers enhanced performance and features that may require updates to software and firmware.
Q3: In which specific scenarios would the XCVU7P-2FLVC2104I be most beneficial?
A3: This chip is particularly beneficial in scenarios requiring high computational power and reliability, such as real-time signal processing in ADAS systems and high-speed data transmission in telecommunications networks.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Robust temperature operation devices
– Enhanced multi-core processing chips