Specification of XCVU5P-L2FLVA2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 75072 |
Number of Logic Elements/Cells | 1313763 |
Total RAM Bits | 190976000 |
Number of I/O | 832 |
Number of Gates | – |
Voltage – Supply | 0.698V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU5P-L2FLVA2104E is ideal for high-performance computing environments such as data centers, cloud computing services, and artificial intelligence training. It excels in handling large-scale data processing tasks efficiently. In industrial settings, it supports real-time control systems in manufacturing plants, ensuring precise operations under varying conditions.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. High Performance: The XCVU5P-L2FLVA2104E offers up to 768 Gbps of memory bandwidth, enabling faster data transfer rates compared to its predecessors.
2. Scalable Architecture: Its modular design allows for easy expansion and integration into existing systems without significant modifications.
3. Energy Efficiency: With a power consumption of only 15W at maximum load, it provides excellent energy efficiency suitable for both server rooms and mobile applications.
4. Industry Certifications: The chip has been certified to meet stringent safety and reliability standards, including ISO 9001 and CE marking.
Frequently Asked Questions
Q1: Can the XCVU5P-L2FLVA2104E be used in high-temperature environments?
A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for various environmental conditions.
Q2: Is there any compatibility issue with older software versions?
A2: The XCVU5P-L2FLVA2104E maintains backward compatibility with most older software versions, but some advanced features may require updates.
Q3: How does the XCVU5P-L2FLVA2104E perform in AI applications?
A3: The chip’s high performance and scalable architecture make it highly effective for AI applications, supporting deep learning models with minimal latency.
Other people’s search terms
– High-performance computing solutions
– Scalable FPGA technology
– Energy-efficient processor
– Industrial-grade FPGA
– AI-accelerated computing platforms