Specification of XCVU5P-2FLVC2104I | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40¡ãC ~ 100¡ãC (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Number of LABs/CLBs | 75072 |
Number of Logic Elements/Cells | 1313763 |
Total RAM Bits | 190976000 |
Number of I/O | 416 |
Applications
The XCVU5P-2FLVC2104I is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU5P-2FLVC2104I operate effectively at extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor applications.
Q2: Is the XCVU5P-2FLVC2104I compatible with existing hardware?
A2: The XCVU5P-2FLVC2104I is backward-compatible with previous models but offers enhanced performance and features that may require updates to software and firmware.
Q3: In which specific scenarios would the XCVU5P-2FLVC2104I be most beneficial?
A3: This chip is particularly beneficial in scenarios requiring high computational power and reliability, such as real-time signal processing in ADAS systems, high-frequency trading in financial markets, and critical communications in remote sensing applications.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Multi-core processing technology
– Robust temperature operation in electronic devices