Specification of XCVU5P-1FLVC2104I | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40¡ãC ~ 100¡ãC (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Number of LABs/CLBs | 75072 |
Number of Logic Elements/Cells | 1313763 |
Total RAM Bits | 190976000 |
Number of I/O | 416 |
Applications
The XCVU5P-1FLVC2104I is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions. Additionally, its capabilities make it suitable for telecommunications infrastructure, supporting complex network protocols.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced parallel processing capability
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU5P-1FLVC2104I operate effectively at extreme temperatures?
A1: Yes, the XCVU5P-1FLVC2104I maintains optimal performance within an operational temperature range of -40¡ãC to +85¡ãC, ensuring reliability across various environments.
Q2: Is the XCVU5P-1FLVC2104I compatible with existing hardware?
A2: The XCVU5P-1FLVC2104I is designed to be backward-compatible with most existing hardware interfaces, facilitating smooth integration into new projects without significant modifications.
Q3: In which specific scenarios would the XCVU5P-1FLVC2104I be most beneficial?
A3: The XCVU5P-1FLVC2104I is particularly beneficial in scenarios requiring high computational power and energy efficiency, such as real-time signal processing in ADAS systems, high-frequency trading in financial markets, and large-scale cloud computing services.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Energy-efficient processing chips
– Industrial-grade FPGA modules