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XCVU3P-L2FFVC1517E

Part Number XCVU3P-L2FFVC1517E
Manufacturer Xilinx
Description IC FPGA 520 I/O 1517FCBGA
Price for XCVU3P-L2FFVC1517E
Specification of XCVU3P-L2FFVC1517E
Status Active
Series Virtex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 49260
Number of Logic Elements/Cells 862050
Total RAM Bits 130355200
Number of I/O 520
Number of Gates
Voltage – Supply 0.698V ~ 0.742V
Mounting Type Surface Mount
Operating Temperature 0C ~ 110C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40×40)

Applications

The XCVU3P-L2FFVC1517E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions.

In industrial settings, this chip is used in manufacturing automation systems that require precise control over machinery operations. Its capabilities make it suitable for telecommunications infrastructure, enhancing network reliability and speed.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High clock frequency up to 600 MHz

2. Advanced multi-core architecture supporting parallel processing

3. Energy-efficient design with low power consumption per gigaflop

4. Compliance with international safety and security certifications

Frequently Asked Questions

Q1: Can the XCVU3P-L2FFVC1517E be integrated into existing systems?

A1: Yes, it supports backward compatibility with previous generations, allowing seamless integration into existing hardware setups.

Q2: What is the maximum memory bandwidth supported by this device?

A2: The XCVU3P-L2FFVC1517E supports a maximum memory bandwidth of 102.4 GB/s, which is sufficient for most high-end computing applications.

Q3: In which specific scenarios would you recommend using the XCVU3P-L2FFVC1517E?

A3: This chip is recommended for scenarios requiring high computational throughput, such as deep learning inference, big data analytics, and real-time signal processing in IoT devices.

Other people’s search terms

– High-performance computing solutions

– Automotive electronics components

– Industrial automation processors

– Telecommunications network enhancement chips

– Low-power high-speed processors

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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