Specification of XCVU35P-L2FSVH2892E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 108960 |
Number of Logic Elements/Cells | 1906800 |
Total RAM Bits | 49597645 |
Number of I/O | 416 |
Number of Gates | – |
Voltage – Supply | 0.698V ~ 0.742V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2892-BBGA, FCBGA |
Supplier Device Package | 2892-FCBGA (55×55) |
Applications
The XCVU35P-L2FSVH2892E is ideal for high-performance computing environments such as cloud servers, AI training, and big data analytics. It supports applications requiring high computational power at temperatures up to 70¡ãC.
Key Advantages
1. High clock speed of up to 600 MHz
2. Advanced multi-core processing architecture
3. Energy consumption of less than 15W under typical load conditions
4. Compliant with industry-standard certifications like ISO 9001 and CE Marking
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCVU35P-L2FSVH2892E?
A1: The XCVU35P-L2FSVH2892E can operate effectively within a temperature range from -40¡ãC to +70¡ãC.
Q2: Can the XCVU35P-L2FSVH2892E be used in environments with high humidity?
A2: Yes, it is designed to withstand high humidity levels up to 95% without degradation of performance.
Q3: In which specific scenarios would the XCVU35P-L2FSVH2892E be most beneficial?
A3: This chip excels in scenarios requiring rapid data processing and analysis, such as real-time video streaming and financial market simulations.
Other people’s search terms
– High-speed FPGA solutions
– Low-power computing devices
– Cloud server optimization tools
– AI hardware accelerators
– Big data processing engines