Specification of XCVU35P-3FSVH2892E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 108960 |
Number of Logic Elements/Cells | 1906800 |
Total RAM Bits | 49597645 |
Number of I/O | 416 |
Number of Gates | – |
Voltage – Supply | 0.873V ~ 0.927V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2892-BBGA, FCBGA |
Supplier Device Package | 2892-FCBGA (55×55) |
Applications
The XCVU35P-3FSVH2892E is ideal for high-performance computing environments such as data centers, AI training, and machine learning applications. It excels in handling large datasets efficiently due to its high processing power and memory bandwidth. This device is also suitable for automotive applications requiring robust and reliable performance under varying conditions.
Key Advantages
1. High clock speed up to 600 MHz
2. Advanced multi-core architecture
3. Low power consumption per gigaflop
4. Compliance with ISO 26262 safety standards
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCVU35P-3FSVH2892E?
A1: The XCVU35P-3FSVH2892E supports operation at temperatures up to 75¡ãC.
Q2: Can the XCVU35P-3FSVH2892E be used in conjunction with other components from the same series?
A2: Yes, it can be seamlessly integrated with other components from the same series, ensuring optimal performance and compatibility.
Q3: In which specific scenarios would you recommend using the XCVU35P-3FSVH2892E over other similar devices?
A3: The XCVU35P-3FSVH2892E is recommended for scenarios that require high computational throughput and low latency, such as real-time analytics and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade computing modules
– Efficient AI processing units
– Robust data center processors
– Safety-certified embedded systems