Specification of XCVU35P-3FSVH2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Voltage – Supply | 0.873V ~ 0.927V |
Mounting Type | Surface Mount |
Operating Temperature | 0¡ãC ~ 100¡ãC (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Number of LABs/CLBs | 108960 |
Number of Logic Elements/Cells | 1906800 |
Total RAM Bits | 49597645 |
Number of I/O | 416 |
Applications
The XCVU35P-3FSVH2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under various environmental conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU35P-3FSVH2104E operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for both indoor and outdoor applications.
Q2: Is the XCVU35P-3FSVH2104E compatible with existing hardware?
A2: The XCVU35P-3FSVH2104E is backward-compatible with previous models but offers enhanced performance and features that may require updated drivers or software configurations.
Q3: In which specific scenarios would you recommend using the XCVU35P-3FSVH2104E?
A3: This chip is recommended for scenarios requiring high computational power and reliability, such as real-time signal processing in ADAS systems, high-frequency trading in financial markets, and critical communications in military-grade applications.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Telecommunications network processors
– Multi-core processing technology
– Robust temperature operation devices