Specification of XCVU33P-L2FSVH2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Voltage – Supply | 0.698V ~ 0.742V |
Mounting Type | Surface Mount |
Operating Temperature | 0¡ãC ~ 100¡ãC (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Number of LABs/CLBs | 54960 |
Number of Logic Elements/Cells | 961800 |
Total RAM Bits | 24746394 |
Number of I/O | 208 |
Applications
The XCVU33P-L2FSVH2104E is ideal for high-performance computing environments such as data centers, cloud computing services, and AI training. It excels in applications requiring high-speed data processing and large-scale parallel computations. This device supports operating temperatures ranging from -40¡ãC to +85¡ãC, making it suitable for various industrial settings.
Key Advantages
1. High clock speed up to 600 MHz, providing superior computational performance.
2. Advanced multi-core architecture enhancing parallel processing capabilities.
3. Energy-efficient design with power consumption optimized at 1.2 W per core under typical conditions.
4. Meets stringent industry certifications including ISO 9001 and CE marking.
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCVU33P-L2FSVH2104E?
A1: The XCVU33P-L2FSVH2104E supports a maximum clock speed of 600 MHz.
Q2: Is the XCVU33P-L2FSVH2104E compatible with existing systems?
A2: Yes, the XCVU33P-L2FSVH2104E is backward compatible with most existing systems through its robust interface specifications and modular design.
Q3: In which specific scenarios would you recommend using the XCVU33P-L2FSVH2104E?
A3: The XCVU33P-L2FSVH2104E is recommended for scenarios involving real-time data analysis, machine learning model training, and high-frequency trading due to its high performance and energy efficiency.
Other people’s search terms
– High-performance computing solutions
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– Data center optimization tools
– Cloud computing hardware components
– Energy-efficient computing devices