| Specification of XCVU33P-1FSVH2104E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 54960 |
| Number of Logic Elements/Cells | 961800 |
| Total RAM Bits | 24746394 |
| Number of I/O | 208 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU33P-1FSVH2104E is ideal for high-performance computing environments such as cloud servers, AI training, and big data analytics. It supports applications requiring high computational power at temperatures up to 85°C.
Key Advantages
1. High clock speed of up to 600 MHz
2. Advanced multi-core processing architecture
3. Energy consumption of less than 15W under typical load conditions
4. Compliant with CE, FCC, and RoHS certification standards
Frequently Asked Questions
Q1: What is the maximum operating temperature?
A1: The maximum operating temperature is 85°C.
Q2: Is it compatible with existing systems?
A2: Yes, it is backward compatible with previous models but offers improved performance and efficiency.
Q3: In which specific scenarios would you recommend using this chip?
A3: This chip is recommended for scenarios requiring high-speed data processing and machine learning tasks, such as real-time video analysis and large-scale database queries.
Other people’s search terms
– High-performance computing solutions
– AI hardware accelerators
– Efficient data processing chips
– Low-power consumption processors
– Industry-standard certified components
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