| Specification of XCVU29P-2FSGA2577I | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 216000 |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 99090432 |
| Number of I/O | 448 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C ~ 100C (TJ) |
| Package / Case | 2577-BBGA, FCBGA |
| Supplier Device Package | 2577-FCBGA (52.5×52.5) |
Applications
The XCVU29P-2FSGA2577I is ideal for high-performance computing environments such as cloud servers, AI training, and big data analytics. It supports applications requiring high computational power at temperatures up to 85¡ãC.
Key Advantages
1. High clock speed up to 600 MHz
2. Advanced multi-core processing architecture
3. Energy consumption of less than 100W under maximum load
4. Compliant with CE, FCC, and RoHS certification standards
Frequently Asked Questions
Q1: Can the XCVU29P-2FSGA2577I be used in high-temperature environments?
A1: Yes, it operates effectively within a temperature range of -40¡ãC to +85¡ãC.
Q2: What is the compatibility of the XCVU29P-2FSGA2577I with other components?
A2: The chip is compatible with various memory types and peripheral interfaces, ensuring seamless integration into existing systems.
Q3: In which specific scenarios would the XCVU29P-2FSGA2577I be most beneficial?
A3: This chip excels in scenarios requiring rapid data processing and high-speed communication, such as real-time data analysis and machine learning algorithms.
Other people’s search terms
– High-performance computing solutions
– AI hardware accelerators
– Cloud server optimization
– Big data processing capabilities
– Energy-efficient computing platforms
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