XCVU27P-1FIGD2104I

Applications

The XCVU27P-1FIGD2104I is ideal for high-performance computing environments such as cloud servers, AI training clusters, and big data analytics platforms. It supports applications requiring high computational power like machine learning models, deep neural networks, and complex simulations. This device operates within a wide temperature range from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.

Key Advantages

1. High Performance: The XCVU27P-1FIGD2104I features advanced processing capabilities with up to 270,000 logic elements, supporting multiple high-speed interfaces.

2. Scalability: Its modular design allows for easy expansion through additional cards, making it suitable for growing workloads without significant hardware changes.

3. Energy Efficiency: Equipped with a low-power mode that reduces energy consumption by up to 60% under light load conditions.

4. Industry Standards: Certified to meet stringent safety and quality standards, including ISO 9001 and CE marking.

Frequently Asked Questions

Q1: Can the XCVU27P-1FIGD2104I be used in environments with extreme temperatures?

A1: Yes, it can operate effectively between -40¡ãC and +85¡ãC, making it suitable for both cold and hot climates.

Q2: What is the maximum number of I/O pins available on the XCVU27P-1FIGD2104I?

A2: The device provides over 2,000 I/O pins, allowing for extensive connectivity options.

Q3: In which specific scenarios would you recommend using the XCVU27P-1FIGD2104I?

A3: The XCVU27P-1FIGD2104I is recommended for scenarios involving large-scale data processing, real-time analysis, and high-bandwidth communication systems.

Other people’s search terms

– High-performance FPGA solutions

– Scalable computing platforms

– Energy-efficient FPGA devices

– Cloud server FPGA accelerators

– AI training cluster FPGA components