| Specification of XCVU23P-2VSVA1365I | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 128700 |
| Number of Logic Elements/Cells | 2252250 |
| Total RAM Bits | 77909197 |
| Number of I/O | 364 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C ~ 100C (TJ) |
| Package / Case | 1365-BFBGA, FCBGA |
| Supplier Device Package | 1365-FCBGA (35×35) |
Applications
The XCVU23P-2VSVA1365I is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems that demand reliable performance under varying conditions.
Key Advantages
1. High clock speed up to 800 MHz
2. Advanced multi-core architecture
3. Low power consumption per gigaflop
4. Compliance with ISO 9001 quality management system
Frequently Asked Questions
Q1: What is the maximum operating temperature range?
A1: The XCVU23P-2VSVA1365I operates within a temperature range from -40¡ãC to +85¡ãC.
Q2: Can this device be used in conjunction with other components?
A2: Yes, it can be integrated with various other components through its extensive I/O capabilities and support for multiple communication protocols.
Q3: In which specific scenarios would you recommend using this device?
A3: This device is recommended for scenarios involving real-time signal processing, high-speed data transmission, and complex algorithm execution in industrial automation systems.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Data center infrastructure improvements
– Cloud computing hardware enhancements
– Reliable processing for critical applications
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