| Specification of XCVU23P-2FSVJ1760E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 128700 |
| Number of Logic Elements/Cells | 2252250 |
| Total RAM Bits | 77909197 |
| Number of I/O | 644 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5×42.5) |
Applications
The XCVU23P-2FSVJ1760E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions.
In industrial settings, this device is used in manufacturing automation systems that require precise control over machinery operations. Its capabilities make it suitable for telecommunications infrastructure, enhancing network reliability and speed.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. High Performance: The XCVU23P-2FSVJ1760E offers exceptional processing power, capable of handling complex computational tasks at speeds up to 1.5 GHz.
2. Scalable Architecture: Its unique multi-core architecture allows for easy scalability, making it adaptable to various application needs without significant redesign.
3. Low Power Consumption: Designed with energy-efficient technologies, it consumes less power compared to similar devices, reducing operational costs significantly.
4. Industry Certifications: Meets stringent industry standards for safety and reliability, ensuring compliance with international regulations.
Frequently Asked Questions
Q1: Can the XCVU23P-2FSVJ1760E be integrated into existing systems?
A1: Yes, its backward compatibility ensures smooth integration into most existing systems without requiring major system modifications.
Q2: What is the maximum memory capacity supported by this device?
A2: The XCVU23P-2FSVJ1760E supports up to 16 GB of DDR4 memory, which can be expanded further depending on specific requirements.
Q3: How does this device perform in extreme weather conditions?
A3: The XCVU23P-2FSVJ1760E maintains optimal performance within a wide range of temperatures (-40¡ãC to +85¡ãC), making it suitable for deployment in diverse environments.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Telecom network enhancement devices
– Energy-efficient processor technology
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