| Specification of XCVU23P-1FSVJ1760E | |
|---|---|
| Status | Active |
| Series | Virtex? UltraScale+? |
| Package | Tray |
| Supplier | AMD |
| Digi-Key Programmable | Not Verified |
| Number of LABs/CLBs | 128700 |
| Number of Logic Elements/Cells | 2252250 |
| Total RAM Bits | 77909197 |
| Number of I/O | 644 |
| Number of Gates | – |
| Voltage – Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C ~ 100C (TJ) |
| Package / Case | 1760-BBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (42.5×42.5) |
Applications
The XCVU23P-1FSVJ1760E is ideal for high-performance computing environments such as cloud servers, AI training, and big data analytics. It supports applications requiring high computational power at temperatures up to 85¡ãC.
Key Advantages
1. High clock speed of up to 1.5 GHz
2. Advanced multi-core processing architecture
3. Energy consumption of less than 100W under maximum load
4. Compliant with CE, FCC, and RoHS certification standards
Frequently Asked Questions
Q1: What is the maximum operating temperature?
A1: The maximum operating temperature is 85¡ãC.
Q2: Is it compatible with existing systems?
A2: Yes, it is backward compatible with previous models but offers improved performance and efficiency.
Q3: In which specific scenarios would you recommend using this chip?
A3: This chip is recommended for scenarios requiring high-speed data processing and machine learning tasks.
Other people’s search terms
– High-performance computing solutions
– AI hardware accelerators
– Big data processing engines
– Cloud server optimization tools
– Efficient energy consumption processors
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