Specification of XCVU190-3FLGB2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 134280 |
Number of Logic Elements/Cells | 2349900 |
Total RAM Bits | 150937600 |
Number of I/O | 702 |
Number of Gates | – |
Voltage – Supply | 0.970V ~ 1.030V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU190-3FLGB2104E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems that demand reliable performance under varying conditions.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum clock frequency supported by the XCVU190-3FLGB2104E?
A1: The XCVU190-3FLGB2104E supports a maximum clock frequency of up to 600 MHz.
Q2: Is the XCVU190-3FLGB2104E compatible with existing hardware?
A2: Yes, it is backward compatible with most existing hardware interfaces and can be integrated into new designs without significant modifications.
Q3: In which specific scenarios would you recommend using the XCVU190-3FLGB2104E?
A3: The XCVU190-3FLGB2104E is recommended for scenarios involving real-time signal processing, machine learning inference, and high-speed data transmission due to its robust performance and energy efficiency.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Cloud computing hardware
– Multi-core processor features
– Energy-efficient computing devices