Specification of XCVU190-2FLGB2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 134280 |
Number of Logic Elements/Cells | 2349900 |
Total RAM Bits | 150937600 |
Number of I/O | 702 |
Number of Gates | – |
Voltage – Supply | 0.922V ~ 0.979V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU190-2FLGB2104E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems due to its robust design and reliability under various environmental conditions.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XCVU190-2FLGB2104E?
A1: The maximum operating temperature of the XCVU190-2FLGB2104E is +85°C.
Q2: Can the XCVU190-2FLGB2104E be used in automotive applications?
A2: Yes, the XCVU190-2FLGB2104E is designed with automotive-grade specifications, ensuring reliability and safety in harsh environments.
Q3: In which specific scenarios would you recommend using the XCVU190-2FLGB2104E?
A3: The XCVU190-2FLGB2104E is recommended for scenarios involving real-time data processing, such as autonomous vehicle control systems and advanced driver assistance systems.
Other people’s search terms
– High-performance computing solutions
– Automotive-grade FPGA
– Multi-core processing technology
– Robust FPGA design
– Efficient power consumption FPGA