XCVU190-2FLGB2104E

Applications

The XCVU190-2FLGB2104E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. Additionally, it is suitable for automotive electronics systems due to its robust design and reliability under various environmental conditions.

Key Advantages

1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS

Frequently Asked Questions

Q1: What is the maximum operating temperature of the XCVU190-2FLGB2104E?

A1: The maximum operating temperature of the XCVU190-2FLGB2104E is +85¡ãC.

Q2: Can the XCVU190-2FLGB2104E be used in automotive applications?

A2: Yes, the XCVU190-2FLGB2104E is designed with automotive-grade specifications, making it suitable for automotive electronics systems.

Q3: In which specific scenarios can the XCVU190-2FLGB2104E be utilized?

A3: The XCVU190-2FLGB2104E can be utilized in scenarios requiring high-speed data processing, such as real-time signal processing in telecommunications networks and high-frequency trading in financial markets.

Other people’s search terms

– High-performance computing solutions
– Automotive-grade FPGA
– Cloud computing processors
– Fast processing FPGAs
– Robust FPGA for industrial applications