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XCVU13P-L2FLGA2577E

Part Number XCVU13P-L2FLGA2577E
Manufacturer Xilinx
Description IC FPGA 448 I/O 2577FCBGA
Price for XCVU13P-L2FLGA2577E
Specification of XCVU13P-L2FLGA2577E
Status Active
Series Virtex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 448
Number of Gates
Voltage – Supply 0.698V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0C ~ 110C (TJ)
Package / Case 2577-BBGA, FCBGA
Supplier Device Package 2577-FCBGA (52.5×52.5)

Applications

The XCVU13P-L2FLGA2577E is ideal for high-performance computing environments such as data centers, where it can handle large-scale parallel processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), where its robustness under extreme conditions is crucial. Additionally, it finds application in telecommunications infrastructure, supporting complex network protocols and ensuring reliable communication services.

Key Advantages

1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Integration of AI accelerators for enhanced machine learning capabilities
3. Power Efficiency Data: Achieves up to 90% power reduction compared to previous generation devices
4. Certification Standards: Meets stringent industrial standards including IEC 61000-4-2 and ISO 26262

Frequently Asked Questions

Q1: Can the XCVU13P-L2FLGA2577E be used in environments with temperatures below -40¡ãC?
A1: No, the device operates within a range of -40¡ãC to +85¡ãC; operation outside this range may lead to performance degradation or hardware failure.

Q2: Is the XCVU13P-L2FLGA2577E compatible with existing systems using older technology standards?
A2: The XCVU13P-L2FLGA2577E is backward-compatible with most existing systems but requires specific firmware updates to ensure seamless integration.

Q3: In which specific scenarios would the XCVU13P-L2FLGA2577E be most beneficial?
A3: This device is particularly beneficial in scenarios requiring high computational throughput, such as real-time data analysis in financial markets, and in safety-critical applications like autonomous vehicles where reliability and performance are paramount.

Other people’s search terms

– High-performance computing solutions
– Automotive electronics components
– Telecommunications network optimization
– Industrial-grade embedded systems
– Advanced machine learning processors

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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