Specification of XCVU13P-L2FHGA2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 216000 |
Number of Logic Elements/Cells | 3780000 |
Total RAM Bits | 514867200 |
Number of I/O | 832 |
Number of Gates | – |
Voltage – Supply | 0.698V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 110C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (52.5×52.5) |
Applications
The XCVU13P-L2FHGA2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions.
In industrial settings, this device is used in manufacturing automation systems that require precise control over machinery operations. Its capabilities make it suitable for telecommunications infrastructure, enhancing network reliability and speed.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. High Performance: The XCVU13P-L2FHGA2104E offers exceptional processing power, capable of handling complex computational tasks at speeds up to 1.6 GHz.
2. Scalable Architecture: Its unique multi-core architecture allows for easy scalability, making it adaptable to various application needs without significant redesign.
3. Low Power Consumption: Designed with energy-efficient technologies, it consumes less power compared to similar devices, reducing operational costs significantly.
4. Industry Certifications: This chip has been certified to meet stringent industry standards, ensuring its reliability and safety in critical applications.
Frequently Asked Questions
Q1: Can the XCVU13P-L2FHGA2104E be used in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for use in harsh environments.
Q2: Is there any specific software required to utilize the features of this chip effectively?
A2: While no proprietary software is necessary, using optimized drivers and compatible development tools enhances its performance and usability.
Q3: How does the XCVU13P-L2FHGA2104E compare to other chips in terms of power efficiency?
A3: Compared to its competitors, the XCVU13P-L2FHGA2104E demonstrates superior power efficiency, consuming approximately 30% less power while maintaining equivalent performance levels.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation hardware
– Telecom network enhancement technology
– Energy-efficient processor architectures