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XCVU13P-L2FHGA2104E

Part Number XCVU13P-L2FHGA2104E
Manufacturer Xilinx
Description IC FPGA 832 I/O 2104FCBGA
Price for XCVU13P-L2FHGA2104E
Specification of XCVU13P-L2FHGA2104E
Status Active
Series Virtex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 832
Number of Gates
Voltage – Supply 0.698V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0C ~ 110C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5×52.5)

Applications

The XCVU13P-L2FHGA2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale data processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions.

In industrial settings, this device is used in manufacturing automation systems that require precise control over machinery operations. Its capabilities make it suitable for telecommunications infrastructure, enhancing network reliability and speed.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High Performance: The XCVU13P-L2FHGA2104E offers exceptional processing power, capable of handling complex computational tasks at speeds up to 1.6 GHz.

2. Scalable Architecture: Its unique multi-core architecture allows for easy scalability, making it adaptable to various application needs without significant redesign.

3. Low Power Consumption: Designed with energy-efficient technologies, it consumes less power compared to similar devices, reducing operational costs significantly.

4. Industry Certifications: This chip has been certified to meet stringent industry standards, ensuring its reliability and safety in critical applications.

Frequently Asked Questions

Q1: Can the XCVU13P-L2FHGA2104E be used in extreme temperatures?

A1: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for use in harsh environments.

Q2: Is there any specific software required to utilize the features of this chip effectively?

A2: While no proprietary software is necessary, using optimized drivers and compatible development tools enhances its performance and usability.

Q3: How does the XCVU13P-L2FHGA2104E compare to other chips in terms of power efficiency?

A3: Compared to its competitors, the XCVU13P-L2FHGA2104E demonstrates superior power efficiency, consuming approximately 30% less power while maintaining equivalent performance levels.

Other people’s search terms

– High-performance computing solutions

– Automotive electronics components

– Industrial automation hardware

– Telecom network enhancement technology

– Energy-efficient processor architectures

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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