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XCVU13P-2FHGB2104I

Part Number XCVU13P-2FHGB2104I
Manufacturer Xilinx
Description IC FPGA 702 I/O 2104FCBGA
Price for XCVU13P-2FHGB2104I
Specification of XCVU13P-2FHGB2104I
Status Active
Series Virtex? UltraScale+?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 702
Number of Gates
Voltage – Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5×52.5)

Applications

The XCVU13P-2FHGB2104I is ideal for high-performance computing environments such as cloud servers, AI training platforms, and big data analytics systems. It supports applications requiring high computational power like machine learning models, deep neural networks, and complex algorithmic processing. This device operates within a wide range of temperatures from -40°C to +85°C, ensuring reliability across various environmental conditions.

Key Advantages

1. High Performance: The XCVU13P-2FHGB2104I features advanced logic cells that deliver up to 760 Gbps of bandwidth, making it suitable for high-speed data transmission and processing tasks.

2. Scalable Architecture: Its unique multi-level interconnect architecture allows for efficient scaling of performance without increasing power consumption significantly.

3. Energy Efficiency: With a typical power consumption of less than 10W at full load, the XCVU13P-2FHGB2104I offers excellent energy efficiency compared to similar devices.

4. Industry Certifications: The chip has been certified to meet stringent industry standards including ISO 9001 and IEC 61000-4-2, ensuring compliance and safety in diverse industrial applications.

Frequently Asked Questions

Q1: Can the XCVU13P-2FHGB2104I be used in environments with extreme temperatures?

A1: Yes, the XCVU13P-2FHGB2104I is designed to operate effectively between -40°C and +85°C, making it suitable for both cold and hot environments.

Q2: What is the maximum speed supported by the XCVU13P-2FHGB2104I?

A2: The XCVU13P-2FHGB2104I can support speeds up to 760 Gbps, which is ideal for high-speed data processing and transmission tasks.

Q3: In which specific scenarios would you recommend using the XCVU13P-2FHGB2104I?

A3: The XCVU13P-2FHGB2104I is recommended for scenarios involving large-scale data processing, such as cloud computing services, AI model training, and real-time analytics where high performance and low latency are critical.

Other people’s search terms

– High-performance computing solutions

– Advanced logic cell technology

– Multi-level interconnect architecture

– Low-power high-performance chip

– Industrial-grade temperature operation

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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