XCVU13P-2FHGB2104E

Applications

The XCVU13P-2FHGB2104E is ideal for high-performance computing environments such as data centers and cloud computing platforms. It excels in applications requiring fast processing speeds and large-scale parallel computing tasks. This device is also suitable for automotive electronics systems due to its robust design and reliability under various environmental conditions.

Key Advantages

1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced multi-core processing capabilities
3. Power Efficiency Data: 1.5W per gigaflop
4. Certification Standards: CE, FCC, RoHS

Frequently Asked Questions

Q1: What is the maximum clock frequency supported by the XCVU13P-2FHGB2104E?

A1: The XCVU13P-2FHGB2104E supports a maximum clock frequency of up to 600 MHz.

Q2: Is the XCVU13P-2FHGB2104E compatible with existing hardware?

A2: Yes, it is backward compatible with most existing hardware interfaces and can be integrated into new designs without significant modifications.

Q3: In which specific scenarios would you recommend using the XCVU13P-2FHGB2104E?

A3: The XCVU13P-2FHGB2104E is recommended for scenarios involving real-time signal processing, machine learning inference, and high-speed data transmission in industrial automation systems.

Other people’s search terms

– High-performance computing solutions
– Automotive electronics components
– Cloud computing hardware
– Multi-core processing technology
– Robust electronic devices