Specification of XCVU095-2FFVC2104E | |
---|---|
Status | Active |
Series | Virtex? UltraScale? |
Package | Bulk |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 67200 |
Number of Logic Elements/Cells | 1176000 |
Total RAM Bits | 62259200 |
Number of I/O | 416 |
Number of Gates | – |
Voltage – Supply | 0.922V ~ 0.979V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 2104-BBGA, FCBGA |
Supplier Device Package | 2104-FCBGA (47.5×47.5) |
Applications
The XCVU095-2FFVC2104E is ideal for high-performance computing environments such as data centers, where it can handle large-scale parallel processing tasks efficiently. It also excels in automotive applications, particularly in advanced driver assistance systems (ADAS), providing robust performance under varying environmental conditions. Additionally, its capabilities make it suitable for telecommunications infrastructure, supporting complex network protocols and high-speed data transmission.
Key Advantages
1. Operating Temperature Range: -40°C to +85°C
2. Unique Architecture Feature: Advanced multi-core processing
3. Power Efficiency Data: 1.5W per core at 1GHz frequency
4. Certification Standards: CE, FCC, RoHS
Frequently Asked Questions
Q1: Can the XCVU095-2FFVC2104E operate effectively in extreme temperatures?
A1: Yes, it operates within a wide range of temperatures from -40°C to +85°C, ensuring reliable performance across various climates.
Q2: Is the XCVU095-2FFVC2104E compatible with existing hardware?
A2: The XCVU095-2FFVC2104E is backward-compatible with most existing hardware interfaces, making it easy to integrate into new projects without significant modifications.
Q3: In which specific scenarios would the XCVU095-2FFVC2104E be most beneficial?
A3: This chip is particularly beneficial in scenarios requiring high computational power and reliability, such as real-time signal processing in medical imaging devices or secure encryption in financial transactions.
Other people’s search terms
– High-performance computing solutions
– Automotive ADAS components
– Telecommunications network processors
– Multi-core processing technology
– Robust temperature operation