XCV400E-6FG676C

Applications

The XCV400E-6FG676C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include operating temperatures ranging from -40°C to +85°C, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 400 MHz, enabling faster data processing capabilities.

2. Advanced memory interface supporting up to 16 GB DDR4 at speeds up to 2933 MHz, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: What is the maximum operating temperature range supported by the XCV400E-6FG676C?

A1: The XCV400E-6FG676C operates within a temperature range of -40°C to +85°C, making it suitable for both cold and hot environments.

Q2: Can the XCV400E-6FG676C be used in conjunction with other components to form a complete system?

A2: Yes, the XCV400E-6FG676C can be integrated with various other components like memory modules, storage devices, and cooling solutions to create a robust system capable of handling complex computational tasks efficiently.

Q3: In which specific scenarios would the XCV400E-6FG676C be most beneficial?

A3: The XCV400E-6FG676C is particularly beneficial in scenarios involving big data analytics, machine learning algorithms, and high-frequency trading systems where rapid data processing and low latency are critical.

Other people’s search terms

– High-speed data processing solution
– Advanced memory interface technology
– Energy-efficient computing module
– Certified for global markets
– Ideal for cloud server applications