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XCV300E-6FG456C

Part Number XCV300E-6FG456C
Manufacturer Xilinx
Description IC FPGA 312 I/O 456FBGA
Datasheets Download XCV300E-6FG456C Datasheet PDFPDF Icon
Price for XCV300E-6FG456C
Specification of XCV300E-6FG456C
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 312
Number of Gates 411955
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23×23)

Applications

The XCV300E-6FG456C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include an operating temperature range from -40°C to +85°C, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 3 GHz, enabling faster processing capabilities compared to its predecessors.

2. Advanced memory interface supporting DDR5, enhancing data transfer rates significantly.

3. Energy-efficient design with a power consumption of less than 100W at maximum load, making it suitable for energy-conscious deployments.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: What is the difference between XCV300E-6FG456C and XCV300E-5FG456C?

A1: The primary difference lies in their clock speeds; XCV300E-6FG456C operates at up to 3 GHz, whereas XCV300E-5FG456C has a lower clock speed of up to 2.5 GHz.

Q2: Can XCV300E-6FG456C be used in environments with extreme temperatures?

A2: Yes, it can operate within a wide temperature range from -40°C to +85°C, making it robust for both cold and hot climates.

Q3: In which specific scenarios would you recommend using the XCV300E-6FG456C?

A3: This chip is recommended for scenarios involving intensive computational tasks like deep learning models, big data analytics, and high-frequency trading systems due to its high performance and low power consumption.

Other people’s search terms

– High-speed data processing solutions

– Energy-efficient computing components

– Cloud server optimization tools

– AI training system enhancements

– Scalable computing platforms

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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