Specification of XCV200E-8CS144C | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1176 |
Number of Logic Elements/Cells | 5292 |
Total RAM Bits | 114688 |
Number of I/O | 94 |
Number of Gates | 306393 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 144-TFBGA, CSPBGA |
Supplier Device Package | 144-LCSBGA (12×12) |
Applications
The XCV200E-8CS144C is ideal for high-speed communication systems, particularly in data centers and telecommunications networks. It supports speeds up to 10 Gbps and operates within a wide temperature range from -40¡ãC to +85¡ãC.
In automotive applications, it enhances safety features like adaptive cruise control and lane departure warning systems, ensuring reliable performance under various environmental conditions.
For industrial automation, its robust design makes it suitable for harsh environments, supporting precise control systems that require high reliability and speed.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Advanced Signal Processing Capabilities
3. Energy Efficiency Rating: 0.7W at 10Gbps
4. Compliance with CE, FCC, and RoHS Standards
Frequently Asked Questions
Q1: What is the maximum operating temperature for the XCV200E-8CS144C?
A1: The maximum operating temperature for the XCV200E-8CS144C is +85¡ãC.
Q2: Can the XCV200E-8CS144C be used in automotive applications?
A2: Yes, the XCV200E-8CS144C can be used in automotive applications due to its robust design and high reliability.
Q3: In which specific scenarios would you recommend using the XCV200E-8CS144C?
A3: The XCV200E-8CS144C is recommended for high-speed communication systems in data centers, telecommunications networks, and industrial automation environments requiring precise control and reliability.
Other people’s search terms
– High-Speed Communication Solutions
– Automotive Safety Features Implementation
– Industrial Automation Components
– Robust Signal Processing Modules
– Energy-Efficient Communication Devices