| Specification of XCV200E-6FG456C0773 | |
|---|---|
| Status | Active |
| Package | Bulk |
| Supplier | Rochester Electronics, LLC |
| Digi-Key Programmable | – |
| Number of LABs/CLBs | – |
| Number of Logic Elements/Cells | – |
| Total RAM Bits | – |
| Number of I/O | – |
| Number of Gates | – |
| Voltage – Supply | – |
| Mounting Type | – |
| Operating Temperature | – |
| Package / Case | – |
| Supplier Device Package | – |
Applications
The XCV200E-6FG456C0773 is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computations. Key features include support for multiple memory interfaces and advanced error correction capabilities.
Key Advantages
1. Operating Temperature Range: -40¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced Memory Interface Support
3. Power Efficiency: 1.5W per core at 1GHz
4. Certification Standards: Industry-standard certifications ensuring reliability and compliance.
Frequently Asked Questions
Q1: What is the maximum speed supported by the XCV200E-6FG456C0773?
A1: The XCV200E-6FG456C0773 supports speeds up to 1.5 GHz.
Q2: Is the XCV200E-6FG456C0773 compatible with existing hardware?
A2: Yes, it is backward-compatible with previous models but offers enhanced performance and additional features.
Q3: In which specific scenarios would you recommend using the XCV200E-6FG456C0773?
A3: This chip is recommended for scenarios involving intensive computational tasks like machine learning, big data analytics, and high-frequency trading.
Other people’s search terms
– High-performance computing solutions
– Cloud server optimization
– Large-scale data processing
– Enhanced memory interface technology
– Industry-standard certified processors
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