XCV2000E-6FG860I

Applications

The XCV2000E-6FG860I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include an operating temperature range from -40¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.

Key Advantages

1. High clock speed up to 750 MHz, providing superior computational performance.

2. Advanced memory interface supporting DDR4 at speeds up to 2666 MHz, enhancing data throughput.

3. Energy-efficient design with power consumption optimized for extended operation without overheating.

4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global market acceptance.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XCV2000E-6FG860I?

A1: The XCV2000E-6FG860I operates within a temperature range of -40¡ãC to +85¡ãC, making it suitable for both cold and hot climates.

Q2: Can the XCV2000E-6FG860I be used in conjunction with other components to form a multi-core system?

A2: Yes, the XCV2000E-6FG860I can be integrated into multi-core systems, leveraging its advanced memory interface and high-speed capabilities to enhance overall system performance.

Q3: In which specific scenarios would the XCV2000E-6FG860I be most beneficial?

A3: The XCV2000E-6FG860I excels in scenarios requiring intensive data processing, such as real-time analytics, machine learning model training, and high-frequency trading systems.

Other people’s search terms

– High-performance computing solutions

– DDR4 memory support

– Energy-efficient processor

– Multi-core system integration

– Cloud server optimization