Specification of XCV200-6FG456C | |
---|---|
Status | Obsolete |
Series | Virtex? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 1176 |
Number of Logic Elements/Cells | 5292 |
Total RAM Bits | 57344 |
Number of I/O | 284 |
Number of Gates | 236666 |
Voltage – Supply | 2.375V ~ 2.625V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 456-BBGA |
Supplier Device Package | 456-FBGA (23×23) |
Applications
The XCV200-6FG456C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It excels in handling large-scale data processing tasks efficiently. Additionally, it is suitable for industrial automation systems that require precise control over machinery operations.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. High clock speed up to 750 MHz
2. Advanced memory interface supporting DDR4 at speeds up to 2666 MHz
3. Energy-efficient design with power consumption optimized for extended operation
4. Compliance with industry-standard certifications like CE, FCC, and RoHS
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCV200-6FG456C?
A1: The XCV200-6FG456C supports a maximum clock speed of 750 MHz.
Q2: Can the XCV200-6FG456C be used in environments with extreme temperatures?
A2: Yes, the XCV200-6FG456C operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for various environmental conditions.
Q3: In which specific scenarios would the XCV200-6FG456C be most beneficial?
A3: The XCV200-6FG456C is particularly beneficial in scenarios requiring high computational performance, such as deep learning model training, big data analytics, and real-time signal processing in industrial settings.
Other people’s search terms
– High-speed FPGA solutions
– Efficient memory interface technology
– Industry-standard certified FPGAs
– Advanced computing platforms
– Precision control in industrial automation