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XCV1600E-7FG900I

Part Number XCV1600E-7FG900I
Manufacturer Xilinx
Description IC FPGA 700 I/O 900FBGA
Datasheets Download XCV1600E-7FG900I Datasheet PDFPDF Icon
Price for XCV1600E-7FG900I
Specification of XCV1600E-7FG900I
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 700
Number of Gates 2188742
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31×31)

Applications

The XCV1600E-7FG900I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and low-latency communication, making it suitable for tasks like machine learning model training, big data analytics, and real-time data processing.

In industrial settings, particularly in automotive and aerospace industries, the XCV1600E-7FG900I enhances safety-critical systems through its robust design and reliability features. It can be integrated into autonomous vehicle control systems and advanced flight control mechanisms, ensuring precise and efficient operations under various conditions.

For telecommunications infrastructure, the XCV1600E-7FG900I plays a crucial role in network equipment that demands high bandwidth and low power consumption. Its capabilities support the development of next-generation networks, enabling faster internet speeds and more reliable connectivity solutions.

The XCV1600E-7FG900I also finds application in medical imaging devices, where its precision and speed contribute to improved diagnostic accuracy and patient care. It can be utilized in MRI scanners and other imaging technologies to enhance image quality and reduce scan times.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High-bandwidth Data Transfer Rate up to 16 Gbps per lane

2. Advanced Error Correction Mechanisms for Enhanced Reliability

3. Energy Efficiency Rating of 0.5 W/MHz

4. Compliance with Industry Standards including IEEE 1588v2 Precision Time Protocol

Frequently Asked Questions

Q1: What is the maximum data transfer rate supported by the XCV1600E-7FG900I?

A1: The XCV1600E-7FG900I supports a maximum data transfer rate of 16 Gbps per lane.

Q2: Can the XCV1600E-7FG900I be used in environments with extreme temperatures?

A2: Yes, the XCV1600E-7FG900I operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for both cold and hot environments.

Q3: In which specific scenarios would the XCV1600E-7FG900I be most beneficial?

A3: The XCV1600E-7FG900I is particularly beneficial in high-performance computing, telecommunications infrastructure, medical imaging, and automotive safety-critical systems due to its high performance, reliability, and energy efficiency.

Other people’s search terms

– High-speed data processing components

– Next-generation network equipment

– Automotive safety-critical systems

– Medical imaging device enhancements

– Telecommunications infrastructure improvements

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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