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XCV1600E-7FG900C

Part Number XCV1600E-7FG900C
Manufacturer Xilinx
Description IC FPGA 700 I/O 900FBGA
Datasheets Download XCV1600E-7FG900C Datasheet PDFPDF Icon
Price for XCV1600E-7FG900C
Specification of XCV1600E-7FG900C
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 700
Number of Gates 2188742
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 900-BBGA
Supplier Device Package 900-FBGA (31×31)

Applications

The XCV1600E-7FG900C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training platforms. It supports applications requiring high-speed data processing and low-latency communication, making it suitable for tasks like machine learning model training, big data analytics, and real-time data processing.

In industrial settings, particularly in automotive and aerospace sectors, the XCV1600E-7FG900C enhances safety-critical systems through its robust design and reliability features. It can be integrated into autonomous vehicle control systems and advanced flight control mechanisms, ensuring precise and efficient operations under various conditions.

For telecommunications infrastructure, the chip plays a crucial role in 5G networks, enabling faster data transmission rates and improved network capacity. Its capabilities support large-scale deployment of 5G base stations, contributing to enhanced mobile broadband services and IoT connectivity.

The XCV1600E-7FG900C also finds application in medical imaging technologies, where its precision and speed are essential for real-time image analysis and diagnostic tools. This makes it a key component in MRI scanners and other medical imaging devices, improving patient care and treatment outcomes.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High bandwidth capability up to 16 Gbps per lane

2. Advanced error correction algorithms for enhanced reliability

3. Energy-efficient design with low power consumption

4. Compliance with multiple industry-standard certifications

Frequently Asked Questions

Q1: What is the maximum bandwidth supported by the XCV1600E-7FG900C?

A1: The XCV1600E-7FG900C supports a maximum bandwidth of 16 Gbps per lane.

Q2: Can the XCV1600E-7FG900C be used in environments with extreme temperatures?

A2: Yes, the XCV1600E-7FG900C operates within a wide range of temperatures from -40¡ãC to +85¡ãC, making it suitable for both cold and hot environments.

Q3: In which specific scenarios would you recommend using the XCV1600E-7FG900C?

A3: The XCV1600E-7FG900C is recommended for scenarios involving high-speed data processing, critical system reliability, and energy-efficient performance, such as in cloud computing, autonomous vehicles, 5G networks, and medical imaging technologies.

Other people’s search terms

– High-bandwidth FPGA solutions

– Automotive-grade FPGA components

– 5G network FPGA processors

– Medical imaging FPGA chips

– Low-power FPGA architectures

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
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Global Logistics
Global logistics are available for delivery
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24/7 Support
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