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XCV1600E-7FG860I

Part Number XCV1600E-7FG860I
Manufacturer Xilinx
Description IC FPGA 660 I/O 860FBGA
Datasheets Download XCV1600E-7FG860I Datasheet PDFPDF Icon
Price for XCV1600E-7FG860I
Specification of XCV1600E-7FG860I
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 660
Number of Gates 2188742
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature -40C ~ 100C (TJ)
Package / Case 860-BGA Exposed Pad
Supplier Device Package 860-FBGA (42.5×42.5)

Applications

The XCV1600E-7FG860I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and low-latency communication, making it suitable for tasks like machine learning model training, big data analytics, and real-time data processing.

In the telecommunications sector, the chip is used in 5G base stations to enhance network performance and capacity. Its capabilities support ultra-fast data transmission rates necessary for modern mobile networks.

For automotive applications, the XCV1600E-7FG860I enables advanced driver-assistance systems (ADAS) and autonomous driving features through its ability to handle complex sensor data and perform rapid computations required for safety-critical functions.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High bandwidth capability up to 16 Gbps per lane

2. Advanced error correction algorithms improving reliability

3. Energy-efficient design reducing power consumption by up to 30%

4. Compliance with multiple industry standards including IEEE 802.3 and ISO/IEC 9899

Frequently Asked Questions

Q1: What is the maximum speed supported by the XCV1600E-7FG860I?

A1: The XCV1600E-7FG860I supports speeds up to 16 Gbps per lane, which can be scaled across multiple lanes depending on the application requirements.

Q2: Is the XCV1600E-7FG860I compatible with existing infrastructure?

A2: Yes, the chip is backward-compatible with previous generations, ensuring smooth integration into existing systems without major modifications.

Q3: In which specific scenarios would you recommend using the XCV1600E-7FG860I?

A3: The XCV1600E-7FG860I is recommended for scenarios that require high-speed data processing and low latency, such as real-time financial trading platforms, high-resolution video streaming services, and IoT devices needing fast response times.

Other people’s search terms

– High-bandwidth FPGA solutions

– Low-power FPGA technology

– Automotive-grade FPGAs for ADAS

– Scalable FPGA architectures for data centers

– 5G base station FPGA components

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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