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XCV1600E-7FG1156C

Part Number XCV1600E-7FG1156C
Manufacturer Xilinx
Description IC FPGA 724 I/O 1156FBGA
Datasheets Download XCV1600E-7FG1156C Datasheet PDFPDF Icon
Price for XCV1600E-7FG1156C
Specification of XCV1600E-7FG1156C
Status Obsolete
Series Virtex?-E
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 7776
Number of Logic Elements/Cells 34992
Total RAM Bits 589824
Number of I/O 724
Number of Gates 2188742
Voltage – Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 1156-BBGA
Supplier Device Package 1156-FBGA (35×35)

Applications

The XCV1600E-7FG1156C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and storage solutions, including video encoding/decoding, big data analytics, and machine learning algorithms.

In industrial settings, it can be utilized in automation control systems, where its robust performance ensures reliable operation under varying conditions. Additionally, it is suitable for automotive applications, particularly in advanced driver assistance systems (ADAS) that demand precise sensor data processing.

Operating Temperature: -40¡ãC to +85¡ãC

Key Advantages

1. High bandwidth support up to 16 Gbps per lane

2. Advanced error correction capabilities enhancing reliability

3. Energy-efficient design reducing power consumption

4. Compliance with multiple industry-standard certifications

Frequently Asked Questions

Q1: What is the maximum speed supported by the XCV1600E-7FG1156C?

A1: The XCV1600E-7FG1156C supports speeds up to 16 Gbps per lane, making it suitable for high-bandwidth applications.

Q2: Can the XCV1600E-7FG1156C be used in environments with extreme temperatures?

A2: Yes, it operates within a wide range of temperatures from -40¡ãC to +85¡ãC, ensuring stable performance across various climates.

Q3: In which specific scenarios would you recommend using the XCV1600E-7FG1156C?

A3: This chip is recommended for scenarios involving high-speed data transmission, such as in cloud computing services, AI model training, and real-time data analysis in industrial IoT setups.

Other people’s search terms

– High-speed data processing solution

– Robust industrial-grade FPGA

– Efficient AI hardware acceleration

– Automotive-grade FPGA for ADAS

– Cloud server FPGA technology

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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