Specification of XCV1600E-6FG900C | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 7776 |
Number of Logic Elements/Cells | 34992 |
Total RAM Bits | 589824 |
Number of I/O | 700 |
Number of Gates | 2188742 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 900-BBGA |
Supplier Device Package | 900-FBGA (31×31) |
Applications
The XCV1600E-6FG900C is ideal for high-speed communication systems, particularly in data centers and telecommunications networks. It supports speeds up to 10 Gbps and operates within a wide temperature range from -40¡ãC to +85¡ãC.
In automotive applications, it enhances safety features like adaptive cruise control and lane departure warning systems, ensuring reliable performance under various environmental conditions.
For industrial automation, its robust design makes it suitable for harsh environments, supporting precise control systems that require high reliability and low latency.
Key Advantages
1. Operating temperature range from -40¡ãC to +85¡ãC, making it highly adaptable to different environments.
2. Incorporates advanced error correction algorithms that improve data integrity at high bit rates.
3. Achieves power consumption of less than 1W per channel, significantly reducing operational costs.
4. Meets stringent industry certifications such as CE, FCC, and RoHS, ensuring compliance with global regulations.
Frequently Asked Questions
Q1: What is the maximum speed supported by the XCV1600E-6FG900C?
A1: The XCV1600E-6FG900C supports speeds up to 10 Gbps, which is ideal for high-speed data transmission requirements.
Q2: Can the XCV1600E-6FG900C be used in automotive applications?
A2: Yes, the XCV1600E-6FG900C is designed to meet automotive standards and can be utilized in various automotive safety systems.
Q3: In which specific scenarios would the XCV1600E-6FG900C be most beneficial?
A3: The XCV1600E-6FG900C excels in scenarios requiring high-speed data transfer and robust performance in extreme temperatures, such as in data centers, telecommunications, and industrial automation settings.
Other people’s search terms
– High-speed communication solutions
– Automotive-grade data transceivers
– Industrial automation components
– Low-power high-performance chips
– Temperature-resistant electronic modules