Specification of XCV1600E-6FG1156I | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 7776 |
Number of Logic Elements/Cells | 34992 |
Total RAM Bits | 589824 |
Number of I/O | 724 |
Number of Gates | 2188742 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1156-BBGA |
Supplier Device Package | 1156-FBGA (35×35) |
Applications
The XCV1600E-6FG1156I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key technical parameters include operating temperatures ranging from -40¡ãC to +85¡ãC.
Key Advantages
1. High bandwidth support up to 16 Gbps per lane.
2. Advanced error correction capabilities enhancing reliability.
3. Energy-efficient design with low power consumption.
4. Compliance with multiple industry-standard certifications.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCV1600E-6FG1156I?
A1: The maximum operating temperature supported by the XCV1600E-6FG1156I is +85¡ãC.
Q2: Can the XCV1600E-6FG1156I be used in environments with extreme cold temperatures?
A2: Yes, it can operate effectively within a range of -40¡ãC to +85¡ãC, making it suitable for both cold and warm climates.
Q3: In which specific scenarios would the XCV1600E-6FG1156I be most beneficial?
A3: The XCV1600E-6FG1156I is particularly beneficial in scenarios involving large-scale data processing, such as big data analytics, machine learning model training, and high-frequency trading systems.
Other people’s search terms
– High-bandwidth FPGA solutions
– Energy-efficient FPGA technology
– Industry-standard certified FPGAs
– Cloud server FPGA components
– Large-scale parallel computing FPGA