Specification of XCV1600E-6BG560C | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 7776 |
Number of Logic Elements/Cells | 34992 |
Total RAM Bits | 589824 |
Number of I/O | 404 |
Number of Gates | 2188742 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 560-LBGA Exposed Pad, Metal |
Supplier Device Package | 560-MBGA (42.5×42.5) |
Applications
The XCV1600E-6BG560C is ideal for high-speed data transmission systems, particularly in telecommunications networks. It supports applications such as fiber optic communication, where it can handle data rates up to 10 Gbps over long distances. Another application is in automotive electronics, enhancing vehicle connectivity and safety features through robust and reliable signal processing.
Key Advantages
1. Operating temperature range from -40°C to +85°C, ensuring reliability across various environmental conditions.
2. Incorporates advanced error correction algorithms that improve data integrity at high speeds.
3. Power consumption is optimized to less than 1W, making it energy-efficient even under heavy load.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: What is the maximum distance supported by the XCV1600E-6BG560C?
A1: The XCV1600E-6BG560C supports up to 10 km using single-mode fiber, which is suitable for most telecommunication needs.
Q2: Is the XCV1600E-6BG560C compatible with existing systems?
A2: Yes, it is backward-compatible with previous models, allowing seamless integration into existing infrastructure without major system upgrades.
Q3: In which specific scenarios would you recommend using the XCV1600E-6BG560C?
A3: This component is recommended for critical applications requiring high-speed data transfer, such as in large-scale data centers and long-haul telecommunications links.
Other people’s search terms
– High-speed data transmission solutions
– Fiber optic communication components
– Automotive electronics signal processors
– Energy-efficient communication modules
– Telecommunications network enhancement tools