Specification of XCV1000E-6FG860I | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6144 |
Number of Logic Elements/Cells | 27648 |
Total RAM Bits | 393216 |
Number of I/O | 660 |
Number of Gates | 1569178 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 860-BGA Exposed Pad |
Supplier Device Package | 860-FBGA (42.5×42.5) |
Applications
The XCV1000E-6FG860I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key features include support for multiple memory channels and advanced error correction capabilities.
In industrial automation, it powers complex control systems that require precise timing and reliability. Its robust design ensures consistent performance under varying environmental conditions, making it suitable for use in harsh industrial settings.
For automotive applications, the XCV1000E-6FG860I enhances vehicle electronics, supporting advanced driver assistance systems (ADAS) and infotainment systems. It provides the necessary bandwidth and processing power for real-time data analysis and decision-making processes.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. High-bandwidth Memory Support: The XCV1000E-6FG860I can handle up to 16Gbps per channel, enabling faster data transfer rates compared to previous generations.
2. Scalable Architecture: Its modular design allows for easy expansion and integration into existing systems without significant modifications.
3. Energy Efficiency: Equipped with advanced power management features, it consumes less energy while maintaining high performance levels.
4. Industry Certifications: The chip meets stringent safety and quality standards, ensuring reliable operation in diverse environments.
Frequently Asked Questions
Q1: What is the maximum supported memory bandwidth?
A1: The XCV1000E-6FG860I supports a maximum memory bandwidth of 16Gbps per channel.
Q2: Is this chip compatible with legacy systems?
A2: Yes, the XCV1000E-6FG860I maintains backward compatibility with older system architectures, allowing for smooth integration into new designs.
Q3: In which specific scenarios would you recommend using this chip?
A3: This chip is recommended for scenarios involving high-speed data processing, such as cloud computing, AI training, and automotive electronics, due to its superior performance and scalability.
Other people’s search terms
– High-performance computing solutions
– Advanced memory support chips
– Automotive electronics components
– Industrial automation processors
– Scalable memory interface technology