Specification of XCV1000E-6FG1156I | |
---|---|
Status | Obsolete |
Series | Virtex?-E |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 6144 |
Number of Logic Elements/Cells | 27648 |
Total RAM Bits | 393216 |
Number of I/O | 660 |
Number of Gates | 1569178 |
Voltage – Supply | 1.71V ~ 1.89V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1156-BBGA |
Supplier Device Package | 1156-FBGA (35×35) |
Applications
The XCV1000E-6FG1156I is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and large-scale parallel computing tasks. Key features include support for multiple memory interfaces and advanced error correction capabilities.
In industrial automation, it powers complex control systems that require precise timing and reliability. Its robust design ensures consistent performance under varying environmental conditions, making it suitable for use in harsh industrial settings.
For automotive applications, the XCV1000E-6FG1156I enhances vehicle electronics, supporting advanced driver assistance systems (ADAS) and infotainment systems. It provides the necessary bandwidth and processing power for real-time data analysis and decision-making processes.
Operating Temperature: -40¡ãC to +85¡ãC
Key Advantages
1. High-bandwidth Memory Interface Support (up to 16Gbps)
2. Advanced Error Correction Code (ECC) for Data Integrity
3. Energy-efficient Design with Low Power Consumption
4. Industry-standard certifications including CE, FCC, and RoHS
Frequently Asked Questions
Q1: What is the maximum supported memory interface speed?
A1: The XCV1000E-6FG1156I can support up to 16Gbps per channel, providing high-speed data transfer rates essential for modern computing applications.
Q2: Is this component compatible with existing systems?
A2: Yes, the XCV1000E-6FG1156I is backward-compatible with previous generations of XCV series components, ensuring seamless integration into existing hardware designs.
Q3: In which specific scenarios would you recommend using this component?
A3: This component is recommended for scenarios requiring high computational throughput and low latency, such as cloud computing platforms, AI training clusters, and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– Automotive electronics components
– Industrial automation processors
– Cloud server memory interfaces
– Advanced driver assistance system components