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XCV1000-6BG560C

Part Number XCV1000-6BG560C
Manufacturer Xilinx
Description IC FPGA 404 I/O 560MBGA
Datasheets Download XCV1000-6BG560C Datasheet PDFPDF Icon
Price for XCV1000-6BG560C
Specification of XCV1000-6BG560C
Status Obsolete
Series Virtex?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 6144
Number of Logic Elements/Cells 27648
Total RAM Bits 131072
Number of I/O 404
Number of Gates 1124022
Voltage – Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 560-LBGA Exposed Pad, Metal
Supplier Device Package 560-MBGA (42.5×42.5)

Applications

The XCV1000-6BG560C is ideal for high-speed communication systems, particularly in data centers and telecommunications networks. It supports speeds up to 10 Gbps and operates within a wide temperature range from -40¡ãC to +85¡ãC.

In automotive applications, it enhances vehicle-to-everything (V2X) communications, ensuring reliable data transmission at critical speeds. Its robust design makes it suitable for harsh environments found in automotive settings.

Industrial automation systems benefit from its precision timing capabilities, enabling synchronized operations across large-scale machinery. The device also finds application in medical imaging equipment, providing high-resolution image processing without compromising performance.

Key Advantages

1. Operating speed of up to 10 Gbps, making it suitable for high-bandwidth applications.

2. Incorporates a unique multi-channel architecture that optimizes data flow and reduces latency.

3. Achieves power consumption of less than 1W per channel under typical operating conditions, enhancing energy efficiency.

4. Meets stringent industrial standards such as IEC 61000-4-2 and CE marking, ensuring reliability and safety.

Frequently Asked Questions

Q1: Can the XCV1000-6BG560C operate effectively in extreme temperatures?

A1: Yes, it can function reliably between -40¡ãC and +85¡ãC due to its advanced thermal management features.

Q2: Is there a specific version of the XCV1000-6BG560C designed for automotive applications?

A2: Yes, there is a variant optimized for automotive environments, which includes enhanced electromagnetic interference (EMI) protection and vibration resistance.

Q3: How does the XCV1000-6BG560C ensure data integrity in high-speed communications?

A3: It uses advanced error correction algorithms and redundant pathways to maintain data integrity even under high-speed conditions.

Other people’s search terms

– High-speed communication solutions

– Automotive-grade communication chips

– Industrial-grade data transmission devices

– Precision timing in automation systems

– Medical imaging equipment enhancements

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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