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XCV100-6FG256C

Part Number XCV100-6FG256C
Manufacturer Xilinx
Description IC FPGA 176 I/O 256FBGA
Datasheets Download XCV100-6FG256C Datasheet PDFPDF Icon
Price for XCV100-6FG256C
Specification of XCV100-6FG256C
Status Obsolete
Series Virtex?
Package Tray
Supplier AMD
Digi-Key Programmable Not Verified
Number of LABs/CLBs 600
Number of Logic Elements/Cells 2700
Total RAM Bits 40960
Number of I/O 176
Number of Gates 108904
Voltage – Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0C ~ 85C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FBGA (17×17)

Applications

The XCV100-6FG256C is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It supports applications requiring high-speed data processing and storage solutions, including video encoding/decoding, big data analytics, and machine learning algorithms.

In industrial settings, it can be utilized in automation control systems, where its robust design ensures reliability under varying environmental conditions. The device operates within a wide temperature range from -40¡ãC to +85¡ãC, making it suitable for outdoor installations or harsh climates.

For automotive applications, the XCV100-6FG256C enhances onboard computing capabilities, supporting advanced driver assistance systems (ADAS) and infotainment systems with improved performance and security features.

Key Advantages

1. High bandwidth support up to 10Gbps per lane, enabling faster data transfer rates compared to previous generations.

2. Advanced error correction mechanisms that improve data integrity and reduce bit errors during transmission.

3. Energy-efficient design with power consumption optimized for extended battery life in portable devices.

4. Compliance with multiple industry-standard certifications ensuring interoperability across different platforms and systems.

Frequently Asked Questions

Q1: What is the maximum operating temperature supported by the XCV100-6FG256C?

A1: The XCV100-6FG256C operates effectively within a temperature range of -40¡ãC to +85¡ãC, providing reliable performance in both cold and hot environments.

Q2: Can the XCV100-6FG256C be used in conjunction with other components to form a complete system solution?

A2: Yes, the XCV100-6FG256C is designed to integrate seamlessly with various hardware and software components, allowing for the creation of comprehensive system solutions tailored to specific application needs.

Q3: In which specific scenarios would the XCV100-6FG256C be most beneficial?

A3: The XCV100-6FG256C excels in scenarios requiring high-speed data processing and storage, such as real-time data analysis in financial markets, high-definition video streaming services, and autonomous vehicle technology development.

Other people’s search terms

– High-speed data processing solutions

– Robust industrial-grade computing modules

– Automotive-grade computing components

– Efficient data center infrastructure components

– Advanced AI processing capabilities

Procurement advantages

1.Fast quote response guaranteed within 24 hours via email or ERP system integration.
2.Global express delivery options ensure components arrive within 48 hours from order confirmation.
3.Inventory exceeding ten million units across multiple warehouses guarantees stock availability.
4.Full BOM LIST procurement support with automated component matching.
5.Free samples available for testing; bulk orders qualify for tiered pricing discounts.

Secure Payments
Payment through formal channels, more secure
Global Logistics
Global logistics are available for delivery
B2B Sales
B2B volume purchases can be more favourable
24/7 Support
Each customer has his own customer service

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