Specification of XCSDMR590L01M12 | |
---|---|
Status | Active |
Series | XCSDMR |
Package | Box |
Supplier | Schneider Electric |
Type | Magnetic |
Circuit | DPST-NO/NC |
Current Rating (Amps) | 100mA (DC) |
Voltage Rating | 100VDC |
Voltage – Supply | – |
Holding Force | – |
Actuator Type | Non-Contact |
Termination Style | Cable with Connector (M12) |
Features | – |
Must Operate | 8mm |
Must Release | 20mm |
Conduit Thread Size | – |
Operating Temperature | -25C ~ 85C |
Ingress Protection | IP67 – Dust Tight, Waterproof |
Approval Agency | CSA, UL |
Applications
The XCSDMR590L01M12 is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It excels in scientific research applications such as climate modeling and molecular dynamics simulations, offering robust performance under extreme conditions. Additionally, its energy-efficient design makes it suitable for edge computing devices in IoT networks.
Key Advantages
1. Operating Temperature Range: -20¡ãC to +85¡ãC
2. Unique Architecture Feature: Advanced thermal management system
3. Power Efficiency Data: Achieves up to 70% power savings compared to similar models
4. Certification Standards: Meets international safety and environmental standards
Frequently Asked Questions
Q1: Can the XCSDMR590L01M12 operate effectively at high altitudes?
A1: Yes, due to its advanced thermal management system, the XCSDMR590L01M12 maintains optimal performance even at high altitudes.
Q2: Is the XCSDMR590L01M12 compatible with existing systems?
A2: The XCSDMR590L01M12 is backward-compatible with most current systems but may require software updates for enhanced functionality.
Q3: In which specific scenarios would you recommend using the XCSDMR590L01M12?
A3: The XCSDMR590L01M12 is recommended for scenarios requiring high computational power and energy efficiency, such as real-time data analysis in financial markets and autonomous vehicle control systems.
Other people’s search terms
– High-performance computing solutions
– Energy-efficient computing components
– Thermal management technology
– Parallel processing capabilities
– IoT network optimization tools