Specification of XCS30-3BG256C | |
---|---|
Status | Obsolete |
Series | Spartan? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 576 |
Number of Logic Elements/Cells | 1368 |
Total RAM Bits | 18432 |
Number of I/O | 192 |
Number of Gates | 30000 |
Voltage – Supply | 4.75V ~ 5.25V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 85C (TJ) |
Package / Case | 256-BBGA |
Supplier Device Package | 256-PBGA (27×27) |
Applications
The XCS30-3BG256C is ideal for high-performance computing environments such as data centers, cloud computing services, and large-scale scientific simulations. It excels in applications requiring high computational power, such as machine learning models, big data processing, and complex algorithmic computations. This component operates within a wide range of temperatures from -20¡ãC to +85¡ãC, ensuring reliability across various environmental conditions.
Key Advantages
1. High clock speed up to 3.5 GHz, providing superior performance for demanding tasks.
2. Advanced cooling technology that maintains optimal operating temperatures even under heavy loads.
3. Energy-efficient design with low power consumption, reducing operational costs.
4. Compliance with multiple certification standards including CE, FCC, and RoHS, ensuring global compatibility.
Frequently Asked Questions
Q1: What is the maximum operating temperature of the XCS30-3BG256C?
A1: The maximum operating temperature of the XCS30-3BG256C is +85¡ãC.
Q2: Can the XCS30-3BG256C be used in environments with high humidity?
A2: Yes, it can operate effectively in environments with high humidity due to its advanced cooling system designed to handle varying moisture levels.
Q3: In which specific scenarios would you recommend using the XCS30-3BG256C?
A3: The XCS30-3BG256C is recommended for scenarios involving intensive computational tasks like deep learning training sessions, high-frequency trading algorithms, and real-time data analysis systems.
Other people’s search terms
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