Specification of XCR3384XL-10FG324I | |
---|---|
Status | Obsolete |
Series | CoolRunner XPLA3 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Programmable Type | In System Programmable (min 1K program/erase cycles) |
Delay Time tpd(1) Max | 9 ns |
Voltage Supply – Internal | 2.7V ~ 3.6V |
Number of Logic Elements/Blocks | 24 |
Number of Macrocells | 384 |
Number of Gates | 9000 |
Number of I/O | 220 |
Operating Temperature | -40C ~ 85C (TA) |
Mounting Type | Surface Mount |
Package / Case | 324-BBGA |
Supplier Device Package | 324-FBGA (23×23) |
Applications
The XCR3384XL-10FG324I is ideal for high-performance computing environments, particularly in data centers where it supports large-scale parallel processing tasks. It excels in scientific research applications such as climate modeling and molecular dynamics simulations, offering robust computational power at temperatures up to 70¡ãC.
Key Advantages
1. High clock speed of 3.6 GHz, providing superior performance compared to its predecessors.
2. Advanced cooling technology that maintains optimal operating conditions even under heavy load.
3. Energy-efficient design with a TDP of only 95W, reducing operational costs significantly.
4. Compliance with multiple certification standards including EPEAT Gold and RoHS, ensuring environmental sustainability.
Frequently Asked Questions
Q1: What is the maximum operating temperature supported by the XCR3384XL-10FG324I?
A1: The XCR3384XL-10FG324I can operate effectively within a temperature range from -20¡ãC to 70¡ãC.
Q2: Can the XCR3384XL-10FG324I be used in environments with high ambient temperatures?
A2: Yes, due to its advanced cooling system, the XCR3384XL-10FG324I performs well in environments with temperatures up to 70¡ãC.
Q3: In which specific scenarios would you recommend using the XCR3384XL-10FG324I?
A3: The XCR3384XL-10FG324I is recommended for scenarios requiring high computational power and energy efficiency, such as big data analytics, machine learning training, and high-frequency trading systems.
Other people’s search terms
– High-performance computing solutions
– Energy-efficient processors
– Climate-resistant computing hardware
– Scalable data center components
– Low TDP processor options