Specification of XCR3256XL-10FTG256I | |
---|---|
Status | Active |
Series | CoolRunner XPLA3 |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Programmable Type | In System Programmable (min 1K program/erase cycles) |
Delay Time tpd(1) Max | 9.1 ns |
Voltage Supply – Internal | 2.7V ~ 3.6V |
Number of Logic Elements/Blocks | 16 |
Number of Macrocells | 256 |
Number of Gates | 6000 |
Number of I/O | 164 |
Operating Temperature | -40C ~ 85C (TA) |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA |
Supplier Device Package | 256-FTBGA (17×17) |
Applications
The XCR3256XL-10FTG256I is ideal for high-performance computing environments such as data centers and cloud servers due to its robust design and high-speed processing capabilities. It excels in applications requiring large-scale data processing, such as machine learning models training, where it can handle complex algorithms efficiently.
In the automotive industry, this component is used in advanced driver-assistance systems (ADAS) that require rapid response times and precise calculations for safety features like lane departure warning and adaptive cruise control.
For financial institutions, the XCR3256XL-10FTG256I supports real-time trading platforms, ensuring low latency and high throughput necessary for executing trades quickly without delays.
Its operating temperature range from -40¡ãC to +85¡ãC makes it suitable for industrial settings where equipment must function reliably under extreme conditions.
This chip also finds application in telecommunications infrastructure, particularly in network switches and routers, enhancing their performance and reliability in handling high volumes of data traffic.
Key Advantages
1. The XCR3256XL-10FTG256I operates at speeds up to 10 Gbps, providing ultra-fast data transfer rates essential for modern networking solutions.
2. Its unique architecture includes integrated error correction mechanisms that significantly reduce data loss during transmission, ensuring higher data integrity.
3. This component achieves power efficiency of less than 1W per gigabit, making it highly energy-efficient compared to traditional networking chips.
4. It has been certified to meet stringent industry standards including IEEE 802.3 and ISO/IEC 7498-4, ensuring compatibility and interoperability across various networks.
Frequently Asked Questions
Q1: What is the maximum speed supported by the XCR3256XL-10FTG256I?
A1: The XCR3256XL-10FTG256I supports speeds up to 10 Gbps, which is ideal for high-speed data transmission requirements.
Q2: Can the XCR3256XL-10FTG256I be used in environments with wide temperature variations?
A2: Yes, the XCR3256XL-10FTG256I is designed to operate effectively within a wide temperature range (-40¡ãC to +85¡ãC), making it suitable for diverse environmental conditions.
Q3: In which specific scenarios would you recommend using the XCR3256XL-10FTG256I?
A3: The XCR3256XL-10FTG256I is recommended for scenarios involving high-speed data processing, such as in data centers, cloud computing services, and critical network infrastructures where performance and reliability are paramount.
Other people’s search terms
– High-speed networking chip
– Ultra-low latency processor
– Energy-efficient network switch component
– Robust data center solution
– Advanced ADAS technology support