XCKU3P-2FFVD900I

Applications

The XCKU3P-2FFVD900I is designed for high-performance computing environments, particularly in fields requiring extensive parallel processing capabilities such as scientific research, financial modeling, and artificial intelligence training.

In scientific research, it supports complex simulations that require significant computational power. For instance, it can handle large-scale molecular dynamics simulations which demand high precision and speed.

In financial modeling, its ability to process vast amounts of data quickly makes it ideal for risk analysis and portfolio optimization models.

For AI training, the XCKU3P-2FFVD900I accelerates deep learning algorithms, enabling faster model training times and more efficient resource utilization.

Operating Temperature: -20°C to +60°C

Key Advantages

1. High Clock Speed: Up to 3 GHz

2. Advanced Interconnectivity: Supports up to 8 lanes PCIe Gen 4

3. Energy Efficiency: Consumes less than 100W at full load

4. Industry Standards Compliance: Meets UL, CE, and FCC certifications

Frequently Asked Questions

Q1: What is the maximum clock speed supported by the XCKU3P-2FFVD900I?

A1: The XCKU3P-2FFVD900I supports a maximum clock speed of up to 3 GHz.

Q2: Can the XCKU3P-2FFVD900I be used in environments with extreme temperatures?

A2: Yes, the XCKU3P-2FFVD900I operates within a wide range of temperatures from -20°C to +60°C, making it suitable for various environmental conditions.

Q3: In which specific scenarios would the XCKU3P-2FFVD900I be most beneficial?

A3: The XCKU3P-2FFVD900I is most beneficial in scenarios requiring high computational performance, such as real-time data processing, machine learning model training, and complex simulation tasks.

Other people’s search terms

– High-performance computing solutions

– Accelerated AI training platforms

– Scientific simulation hardware

– Financial modeling tools

– Energy-efficient computing components