Specification of XCKU15P-L2FFVE1760E | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 65340 |
Number of Logic Elements/Cells | 1143450 |
Total RAM Bits | 82329600 |
Number of I/O | 668 |
Number of Gates | – |
Voltage – Supply | 0.698V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | 0C ~ 100C (TJ) |
Package / Case | 1760-BBGA, FCBGA |
Supplier Device Package | 1760-FCBGA (42.5×42.5) |
Applications
The XCKU15P-L2FFVE1760E is ideal for high-performance computing environments such as cloud servers, data centers, and AI training systems. It excels in handling large-scale data processing tasks efficiently. Additionally, it supports various industrial applications like smart manufacturing, where its robust design ensures reliability under harsh conditions.
Operating Temperature: -40°C to +85°C
Key Advantages
1. High clock speed up to 3.0 GHz
2. Advanced memory interface supporting DDR5
3. Energy-efficient design with low power consumption
4. Compliance with industry-standard certifications
Frequently Asked Questions
Q1: What is the maximum clock speed supported by the XCKU15P-L2FFVE1760E?
A1: The XCKU15P-L2FFVE1760E supports a maximum clock speed of 3.0 GHz.
Q2: Is the XCKU15P-L2FFVE1760E compatible with existing DDR4 memory modules?
A2: No, the XCKU15P-L2FFVE1760E requires DDR5 memory modules due to its advanced memory interface capabilities.
Q3: In which specific scenarios would you recommend using the XCKU15P-L2FFVE1760E?
A3: The XCKU15P-L2FFVE1760E is recommended for scenarios requiring high computational performance and energy efficiency, such as deep learning model training and big data analytics.
Other people’s search terms
– High-performance computing solutions
– DDR5 memory support
– Low-power consumption processors
– Industry-standard certified components
– Smart manufacturing technology