Specification of XCKU11P-2FFVE1517I | |
---|---|
Status | Active |
Series | Kintex? UltraScale+? |
Package | Tray |
Supplier | AMD |
Digi-Key Programmable | Not Verified |
Number of LABs/CLBs | 37320 |
Number of Logic Elements/Cells | 653100 |
Total RAM Bits | 53964800 |
Number of I/O | 512 |
Number of Gates | – |
Voltage – Supply | 0.825V ~ 0.876V |
Mounting Type | Surface Mount |
Operating Temperature | -40C ~ 100C (TJ) |
Package / Case | 1517-BBGA, FCBGA |
Supplier Device Package | 1517-FCBGA (40×40) |
Applications
The XCKU11P-2FFVE1517I is ideal for high-performance computing environments such as data centers and cloud servers. It excels in applications requiring fast processing speeds, like artificial intelligence training, big data analytics, and scientific simulations. This device operates within a wide temperature range from -40°C to +85°C, making it suitable for various global deployment scenarios.
Key Advantages
1. High clock speed up to 3.6 GHz, providing superior computational performance.
2. Advanced power management system that reduces energy consumption by up to 20% compared to similar products.
3. The device supports up to 16GB of DDR5 memory, enhancing its data handling capabilities.
4. Meets stringent industry certifications including CE, FCC, and RoHS compliance.
Frequently Asked Questions
Q1: Can the XCKU11P-2FFVE1517I be used in extreme temperatures?
A1: Yes, it can operate effectively between -40°C and +85°C due to its robust thermal design.
Q2: Is there any specific hardware requirement when using this chip?
A2: The chip requires a compatible motherboard with at least two PCIe slots and support for DDR5 memory.
Q3: In which industries is the XCKU11P-2FFVE1517I commonly used?
A3: Commonly used in data centers, cloud computing services, and research institutions for high-performance computing tasks.
Other people’s search terms
– High-speed processor for AI training
– Energy-efficient computing solution
– DDR5 memory support
– Wide temperature range processor
– Cloud server optimization chip